Thermal silica application area

The thermal silica gel can be widely applied to the contact surfaces between the heating elements (power tubes, thyristors, electric heat stacks, etc.) and the heat dissipation facilities (heat sinks, heat sinks, housings, etc.) in various electronic products and electrical equipment. It functions as a heat transfer medium, moisture-proof, dust-proof, anti-corrosion, and shockproof. It is suitable for surface coating or overall encapsulation of various microwave devices such as microwave communication, microwave transmission equipment, microwave power supply, and power supply. These silicon materials provide excellent heat conduction for the electronic components that generate heat. Such as: Transistors, CPU assembly, thermistors, temperature sensors, automotive electronic components, automotive refrigerators, power modules, printer heads, etc. K thermal silica film.