Thermal conductive material

With high thermal conductivity, high insulation resistance characteristics. For the insulation and heat dissipation of electronic devices, it has good resistance to electric shock and thermal conductivity. The heat dissipation of heat-conducting insulating materials can be applied from low to medium power to high power applications. Films with high thermal conductivity and high flexibility are easy to adapt to gap filling between heat sinks and components. They are the best choice for materials Applications: power conversion devices, power semiconductors, automotive electronics, power supplies and UPS systems, micro Processors, memory modules and cache memory chips.