Conductive potting glue

With the same viscosity, it has the highest thermal conductivity in the industry.

Add molding reaction, the volume will not change during the curing process, thereby reducing the stress on the components of the package.

The cured product has a very low coefficient of thermal expansion.

It has very low viscosity and good leveling under the same thermal conductivity. Adapted to small module potting. Easily vent bubbles.

In the case of no primer coating, it has strong adhesion to metal and electronic surfaces.

Add molding curing, local temperature rise in a closed environment will not produce decomposition.

Blocks the effects of moisture and dust on the components.

Anti-poisoning properties.

All products meet the UL 94 V0 flammability rating. Some products have UL certification.